Explore growth prospect of Flip Chip Market by key players IBM Corporation, Intel Corporation,Apple, Fujitsu, 3M, Samsung electronics, Amkor Technology
The global market is expected to garner $46 billion by 2022, registering a CAGR of 9% during the period 2016-2022. Impending need of circuit miniaturization, thriving portable devices industry and technological superiority over wire bond connections are major factors expected to propel the growth in global flip chip market. However, availability of less customization options as well as high capital investment requirements for setting up a new plant are the limitations that restrict the market growth.
This report provides an in-depth overview of the Flip Chip market. This includes market characteristics, consisting of segmentation, market share, trends and strategies for this market. The Market Size section provides historical forecasts of market growth and future. Further the major companies operating within the market are also analyzed in the report
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The key players operating in flip chip market are IBM Corporation, Intel Corporation, Fujitsu Ltd, 3M, Samsung electronics Co., Ltd, Amkor Technology, Inc., TSMC, Ltd, Apple, Inc., Texas Instruments, Inc., and AMD, Inc. among others.
The market is segmented on the basis of flip chip packaging technology, bumping technology, industry vertical, and geography. Based on bumping technology, the market comprises copper pillar, solder bumping, gold bumping and others including aluminum & conductive polymer bumping. The copper pillar segment dominates the market as it is a next generation flip chip interconnect which offers advantages in many designs while meeting current and future electronic device requirements. It is an excellent interconnect choice for applications such as transceivers, embedded processors, and application processors.
Asia-pacific dominated the market in the year 2015 by accounting over 50% of the total market revenue and it is expected to maintain its dominance throughout the forecast period. This is accredited to the presence of various manufacturing facilities in the region, high consumption and production of electronic products where flip chip is steadily replacing wire bond and ongoing research and development in the region.
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Table of Contents
Chapter 1: Introduction
Chapter 2: Executive Summary
Chapter 3: Market Overview
Chapter 4: Flip Chip Market By Packaging Technology
Chapter 5. Global Flip Chip Market, By Bumping Technology
Chapter 6. Global Flip Chip Market, By Geography
Chapter 7. Company Profiles
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